Electronic silicone rubber contains: LED potting and electronic potting. Electronic silicone rubber for LED potting is an auxiliary material for LED packaging. It has high refractive index and high light transmittance. It can protect the LED chip and increase the luminous flux of the LED. It has small viscosity and easy defoaming. It is suitable for potting and molding, so that the LED has Better durability and reliability. Electronic potting compound is a multi-purpose potting material. It has excellent electrical insulation, no corrosion and small shrinkage after curing. It is suitable for insulation, waterproof, dustproof and fixing of electronic components. The vulcanized colloid is moderate in strength, It is easy to overhaul and maintenance.
Excellent bonding performance, strong adhesion to PPA, metal, etc., high strength, resistant to 10MPA tensile test.
硬度高,抗外力性能佳,耐候性佳,抗UV耐黄变性能优秀。
Effective foam suppression performance can greatly improve packaging efficiency, good penetration, and light transmittance of 99%.
Good fluidity, excellent resistance to high and low temperature, ozone, radiation, water and aging, super elastic, excellent electrical performance and easy operation.
大功率LED灌封胶产品参数表 | ||||||||||||||
NO | 产品型号及规格 | 外观 | 固化剂型号 | 粘度(mpa,s) | 操作时间(min/25℃) | 表干时间(85℃/min) | 固化时间(H) | 固化条件 | 硬度(邵A±2) | 拉伸强度24h(Mpa) | 工作温度范围 | 耐压强度(KV/mm) | 体积电阻(ΩNaN) | 主要用途 |
1 | YZ95-50# | 透明 | YZ95-50B | 9000 | >8 | 30 | 4 | 85℃/60Min +150℃/3H | 50A | 3 | -60℃ ~250℃ | 19 | 5.6*1014 | SMD封装 |
2 | YZ95-60# | 透明 | YZ95-60B | 9000 | >8 | 30 | 4 | 85℃/60Min +150℃/3H | 60A | 5 | -60℃~250℃ | 19 | 5.3*1014 | SMD封装 |
3 | YZ95-70# | 透明 | YZ95-70B | 9000 | >8 | 30 | 4 | 85℃/60Min +150℃/3H | 70A | 7 | -60℃~250℃ | 18 | 5.5*1014 | SMD封装 |
4 | YZ96-65# | 透明 | YZ96-65B | 5800 | >8 | 30 | 4 | 85℃/60Min +150℃/3H | 65A | 4 | -60℃~250℃ | 24 | 2.67*1015 | 模顶封装 |
5 | YZ96-77# | 透明 | YZ96-77B | 3300 | >8 | 30 | 4 | 85℃/60Min +150℃/3H | 77A | 7 | -60℃~250℃ | 26 | 2.66*1016 | 模顶封装 |
6 | YZ97-66# | 透明 | YZ97-66B | 7600 | >8 | 30 | 4 | 85℃/60Min +150℃/3H | 65A | 7 | -60℃~250℃ | 18 | 2.67*1015 | COB封装 |
7 | YZ97-55# | 透明 | YZ97-55B | 7600 | >8 | 30 | 4 | 85℃/60Min +150℃/3H | 55A | 5 | -60℃~250℃ | 18 | 1.1*1013 | COB封装 |
8 | YZ97-45# | 透明 | YZ97-45B | 7900 | >8 | 30 | 4 | 85℃/60Min +150℃/3H | 45A | 4 | -60℃~250℃ | 22 | 1.9*1013 | COB封装 |
9 | YZ95-22# | 透明 | YZ95-22B | 2200 | >12 | 30 | 4 | 100℃/4H | 20A | 1 | -60℃~150℃ | 23 | 1*1016 | PC透镜封装 |
10 | YZ95-20# | 透明 | YZ95-20B | 2200 | >12 | 30 | 4 | 100℃/4H | 20A | 1 | -60℃~150℃ | 24 | 1*1016 | PC透镜封装 |
电子灌封胶产品参数表 | |||||||||||
NO | 产品型号及规格 | 外观 | 固化剂型号 | 粘度(mpa,s) | 操作时间(min/25℃) | 固化时间(H) | 固化条件 | 硬度(邵A/邵C±2) | 耐压强度(KV/mm) | 体积电阻(ΩNaN) | 用途 |
1 | 945# | 黑色 | WD-28# 10% | 1350±10% | 15-25 | 3 | 室温 | 18C | 15 | 1.0*1011 | 显示屏灌封 |
2 | 959# | 黑色 | WD-28# 10% | 1600±10% | 15-25 | 3 | 室温 | 12C | 15 | 1.0*1011 | 显示屏灌封 |
3 | 988# | 黑色 | 988B# 10% | 2400±10% | 15-25 | 3 | 室温 | 22C | 15 | 1.0*1011 | 显示屏灌封 |
4 | 915# | 黑色 | KD-15# 5% | 1850±10% | 15-25 | 3 | 室温 | 10C | 15 | 1.0*1011 | 电子元器件灌封 |
5 | 918# | 黑色 | KD-28# 5% | 2000±10% | 15-25 | 3 | 室温 | 20C | 15 | 1.0*1011 | 电子元器件灌封 |
6 | 900# | 透明 | KD-16# 5% | 3000±10% | 25-35 | 6 | 室温 | 30C | 15 | 1.0*1011 | LED背光源灌封 |
7 | 920# | 透明 | 920B# 1:1 | 3000±10% | 60-180 | 6-8 | 室温或加热 | 28C | 18 | 1.5*1015 | 电子模组灌封 |
8 | 928# | 白色 | WD-28# 10% | 2800±10% | 15-25 | 3 | 室温 | 22C | 15 | 1.0*1011 | 电子模组灌封 |
9 | 9800#-3 | 黑灰色 | 9800B#-3 1:1 | 2800±10% | 30-60 | 4-6 | 室温或加热 | 50A | 18 | 5.0*1014 | 导热阻燃 |
10 | 9776# | 无色透明 | 9776B# 2.5% | 3750±10% | 15-25 | 3 | 室温 | 12A | 28 | 1.0*1012 | 软灯条灌封 |
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